We cordially invite you to submit a poster for the UCLA CHIPS workshop. The topics of interest are as follows:

• Assembly and Packaging Technology
• Reliability
• Power Delivery
• Thermal Management
• High Bandwidth connectors, including wired, RF, and Photonics
• Scale-down and Scale-out System Architectures
• Chiplet and Dielet ecosystem
• EDA
• Hardware Security

Attached to the flyer is the sample poster template. Use the format "Student_Professor CHIPS_2025" when submitting the poster.
The posters can be sent via email to Naaren (msnaaren2330@g.ucla.edu), Hetal Jain (hetaljain12@g.ucla.edu) with the subject "UCLA CHIPS 2025 Poster, Track". In case of any questions, please contact Jui Han (jhliu10@g.ucla.edu), Siyun (qiaosy@g.ucla.edu), Naaren (msnaaren2330@g.ucla.edu).

Dates:
First submission: October 27 (10/27/2025 (Monday))
Review: November 03 (11/03/2025 (Monday))
Final submission: November 14 (11/14/2025 (Friday))

 

2025 UCLA CHIPS Symposium Poster Template

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