Interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes, that will shrink system footprint and improve power and performance.
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Flexible fan-out At ECTC, the University of California at Los Angeles (UCLA) described more details about a fan-out wafer-level packaging integration process using a flexible substrate. In the works for some time, UCLA refers to its flexible substrate technology as FlexTrate. In its latest work, researches...
3-D Printed Metal-Pipe Rectangular Waveguides Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn Publication Year: 2015, Page(s):1339-1349 An Electrohydrodynamic Jet Printing System With Metal Nanoparticle-Based Ink: Experimental...
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Distinguished Lecture: Packaging – When all else fails! Or Why I became a packaging Engineer