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Mission Statement

Interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes, that will shrink system footprint and improve power and performance.

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News


5 Most Popular T-CPMT Articles according to Xplore® usage statistics March 2019

3-D Printed Metal-Pipe Rectangular Waveguides Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn Publication Year: 2015, Page(s):1339-1349 An Electrohydrodynamic Jet Printing System With Metal Nanoparticle-Based Ink: Experimental...

3DInCities "A Race to the Finish: Announcing the Winners of the 2019 3D InCites Awards"

Research Institute of the Year: UCLA’s CHIPS Lab

3DInCites "System-level Scaling: UCLA’s Answer to Extending Moore’s Law" by Francoise von Trapp

“We are at a crossroads. Current chip design is nearing its capacity. The time, expense, and effort needed to make major inroads have grown exponentially. We need a transformational shift in how our systems are designed and put together. Moore’s law is no longer about scaling a chip, but about...

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Conferences


2019 International Microwave Symposium May 21, 2019

Boston, MA

iMAPS MiNaPAD Forum 2019 May 21, 2019

Distinguished Lecture: Packaging – When all else fails! Or Why I became a packaging Engineer

iMAPS MiNaPAD Forum 2019 May 21, 2019

Grenoble, France

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