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Mission Statement

Interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes, that will shrink system footprint and improve power and performance.

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Fine Pitch(40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level Packaging

A flexible fan-out wafer-level packaging (FOWLP) process for heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package (FlexTrate TM ) was used to assemble 625 dies with co-planarity and tilt <1µm, average die-shift of 3.28 µm with σ < 2.23 µm. Fine pitch ...

Characterization of Fine Pitch Interconnections (<=10um) on Silicon Interconnect Fabric for Heterogeneous Integration - Siva Jangam

The Silicon-Interconnect Fabric (Si-IF) is a highly scalable platform for heterogenous integration of dielets. We propose a fine-pitch integration scheme where dielets are attached to the Si-IF with fine-pitch interconnects (≤10 µm) at short inter-dielets spacings (≤100 µm) using direct metal-metal Thermal Compression Bonding process (TCB). As a result, short...

Dynamically Controlled Flow Loop to Benchmark Rapid Transient Cooling Utilizing Flash Boiling for High Heat Flux Electronic Systems - Ujash Shah

Transient cooling of high-heat-flux components presents significant challenges. Flash cooling is a promising approach to mitigate temperature spikes due to episodic heat pulses in electronic components. We present a flow loop concept that provides a flexible and reliable setup to quantify and benchmark flash cooling. The testbed...

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Conferences


2018 UCLA CHIPS IAB Meeting November 1, 2018

UCLA Electrical and Computer Engineering Department

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