Mission Statement

Interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes, that will shrink system footprint and improve power and performance.

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Goodbye, Motherboard. Hello, Silicon-Interconnect Fabric By Puneet Gupta and Subramanian S. Iyer (IEEE Spectrum)

The need to make some hardware systems tinier and tinier and others bigger and bigger has been driving innovations in electronics for a long time. The former can be seen in the progression from laptops to smartphones to smart watches to hearables and other “invisible” electronics. The latter defines today’s...

Making More of Moore’s Law

UCLA researchers have a plan to redesign computer chips from the ground up to make smaller, cheaper, and more dynamic electronic devices. If you crack open any of the electronic devices you use on a daily basis— your phone, smartwatch, tablet, TV, instant pot or microwave— you’ll...

Semiconductor Engineering Article: Making microvias in packages; flexible fan-out.

Flexible fan-out At ECTC, the University of California at Los Angeles (UCLA) described more details about a fan-out wafer-level packaging integration process using a flexible substrate. In the works for some time, UCLA refers to its flexible substrate technology as FlexTrate. In its latest work, researches...

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2019 UCLA CHIPS Workshop November 6, 2019

UCLA Luskin Conference Center

2019 International Microwave Symposium May 21, 2019

Boston, MA

iMAPS MiNaPAD Forum 2019 May 21, 2019

Distinguished Lecture: Packaging – When all else fails! Or Why I became a packaging Engineer

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