Adeel Bajwa, SivaChandra Jangam, Saptadeep Pal, Boris Vaisband, Randall Irwin, Mark Goorsky, and Subramanian S. Iyer "Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) assembly," IEEE 68th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2018, Orlando, FL. (Accepted)
Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, and Subramanian S. Iyer "Self-Assembly Technologies for FlexTrateTM" IEEE 68th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2018, Orlando, FL. (Accepted).
Amir Hanna, T. Fukushima, A. Alam, S. Moran, W. Whitehead, S. Jangam, R. Irwin, A. Bajwa, S. Pal, and S. S. Iyer, "Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-based Interconnects," IEEE 68th IEEE Electronic Components and Technology Conference (ECTC), May 29-June 1, 2018, Orlando, FL. (Accepted)
William Whitehead, S. Moran, B. Gaonkar, L. Macyszyn, and S. S. Iyer, "A Deep Learning Approach to Spine Segmentation using a Feed-forward Chain of Pixel-wise Convolutional Networks," IEEE International Symposium on Biomedical Imaging (ISBI), April 4-7, 2018, Washington D.C. (Accepted)
B. Vaisband, A. Bajwa, and S. S. Iyer, “Network on Interconnect Fabric,” Proceedings of the IEEE International Symposium on Quality Electronic Design, March 2018. (Accepted)
Saptadeep Pal, D. Petrisko, A. Bajwa, P. Gupta, S. S. Iyer, and R. Kumar "A Case for Packageless Processors", 24th IEEE International Symposium on High-Performance Computer Architecture (HPCA), February 24-28, 2018, Vienna, Austria.
R. M. Walker, L. Rieth, S. S. Iyer, A. A. Bajwa, J. Silver, T. Ahmed, N. Tasneem, M. Sharma, A. Gardner, "Integrated neural interfaces," 2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS), Boston, MA, USA, 2017, pp. 1045-1048. doi: 10.1109/MWSCAS.2017.8053106
Arsalan Alam, T. Fukushima, A. Hanna, S. C. Jangam, A. Bajwa, and S. S. Iyer, "FlexTrateTM: For next generation high performance flexible systems", FlexTech Flexible & Printed Electronics Conference & Exhibition (2017 Flex), June 19-22, 2017, Monterey, CA
Chandrasekara Kothandaraman, S. Rosenblatt, J. Safran, P. Oldiges, P. Kulkarni-Kerber, J. Xumalo, W. Landers, J. Liu, J. A. Oakley, S. Butt, T. L. Graves-Abe, N. Robson, M. G. Farooq, D. Berger and S. S. Iyer, "Vertical channel devices enabled by through silicon via (TSV) technologies," 2016 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2016, pp. 9.6.1-9.6.4. doi: 10.1109/IEDM.2016.7838384
Takafumi Fukushima, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, and S. S. Iyer, "A New Flexible Device Integration Technology Based on Fan-Out Wafer-Level Packaging", Printed Electronics USA in IDTechEx show, p.96, Nov. 16-17, 2016, Santa Clara, CA, Academic Posters.
Brittany Hedrick, V. Sukumaran, B. Fasano, C. Tessler, J. Garant, J. Lubguban, S. Knickerbocker, M. Cranmer, K. Ramachandran, I. Melville, D. Berger, M. Angyal, R. Indyk, D. Lewison, C. Arvin, L. Guerin, M. Cournoyer, M. P. L. Ouellet, J. Audet, F. Baez, S. Li, and S. S. Iyer, "End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016, pp. 283-288. doi: 10.1109/ECTC.2016.261
Gregory Fredeman, D. Plass, A. Mathews, J. Viraraghavan, K. Reyer, T. Knips, T. Miller, E. Gerhard, D. Kannambadi, C. Paone, D. Lee, D. Rainey, M. Sperling, M. Whalen, S. Burns, R. Tummuru, H. Ho, A. Cestero, N. Arnold, B. Khan, T. Kirihata, and S. S. Iyer, "A 14 nm 1.1 Mb Embedded DRAM Macro With 1 ns Access," in IEEE Journal of Solid-State Circuits, vol. 51, no. 1, pp. 230-239, Jan. 2016. doi: 10.1109/JSSC.2015.2456873
Muqta G. Farooq, G. La. Rosa, F. Chen, P. Periasamy, T. Graves-Abe, C. Kothandaraman, C. Collins, W. Landers, J. Oakley, J. Liu, J. Safran, S. Ghosh, S. Mittl, D. Ioannou, C. Graas, D. Berger, and S. S. Iyer, "Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability," 2015 IEEE International Reliability Physics Symposium, Monterey, CA, 2015, pp. 4C.1.1-4C.1.8. doi: 10.1109/IRPS.2015.7112732