Thank you for attending the 2017 UCLA CHIPS Workshop on November 1,2017.

Below are some of the presentation slides from our guest speakers.

We will continue to update the site so please check back with us for more presentations.

Chuei-Tang Wang - TSMC "WLSI technologies for Heterogeneous Integration"

William Chen - ASE "Heterogeneous Integration Roadmap – Global Collaboration"

Daniel Tracy - SEMI "Semiconductor Outlook: A Connected World and Changes in the Packaging Landscape"

Daniel Green - DARPA "DARPA’s Role in Heterogeneous Integration" *Currently Unavailable

Srinivasa Banna - GlobalFoundries "Supply Chain Integrity for Heterogeneous Integration"

Subramanian Iyer - UCLA "CHIPS Report"