Semiconductor Engineering Article: Making microvias in packages; flexible fan-out.

Flexible fan-out At ECTC, the University of California at Los Angeles (UCLA) described more details about a fan-out wafer-level packaging integration process using a flexible substrate. In the works for some time, UCLA refers to its flexible substrate technology as FlexTrate. In its latest work, researches demonstrated a foldable display with LED dielets. Flexible hybrid electronics are gaining steam in the market. The technology enables the integration of dies on a flexible organic substrate. But there are some challenges with the technology.