UCLA CHIPS Presentations at ECTC 2020

June 3 - 30, 2020 - Virtual Conference (Registration link)

A High Spatial Resolution Surface Electromyography (sEMG) System Using Fan-Out Wafer-Level Packaging on FlexTrate^TM
Alam, Arsalan (Session 22, Talk 3)

Heterogenous Integration of MEMS Gas Sensor using FOWLP : Personal Environment Monitors
Benedict, Samatha (Session 18, Talk 3)

Antenna on Silicon Interconnect Fabric
Dasgupta, Arpan (Session 38, Talk 8)

A Heterogeneously Integrated, High Resolution and Flexible Inorganic μLED Display using Fan-Out Wafer-Level Packaging
Ezhilarasu, Goutham (Session 15, Talk 3)

Nanowire Impregnated Poly-dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out Wafer-Level Packaging
Irwin, Randall (Session 34, Talk 2)

Demonstration of a Low Latency (<20 ps) Fine-pitch (≤10 μm) Assembly on the Silicon Interconnect Fabric
Jangam, SivaChandra (Session 38, Talk 10)

Deep Trench Capacitors in Silicon Interconnect Fabric
Kalappurakal Thankappan, Kannan (Session 45, Talk 11)

Atomic Layer Deposited Al₂O₃ Encapsulation for the Silicon Interconnect Fabric
Shakoorzadeh-Chase, Niloofar (Session 27, Talk 6)

Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding
Yang, Yu-Tao (Session 39, Talk 6)

Why all this hype about Heterogeneous Integration?
Subramanian Iyer (Special Sessions: Future Seminconductor Packages for Artificial Intelligence Hardware)

 

Special Sessions: HIR Workshop – The Next Phase of Innovation: Heterogeneous Integration