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2023 UCLA CHIPS Workshop Agenda for in-person workshop CNSI UCLA Auditorium 1st Floor 570 Westwood Plaza, Los Angeles, CA 90095 8:00 am PST to 6:00 pm PST, December 6th, 2023.
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8:00 - 9:00 AM |
Breakfast / Registration |
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9:00 - 9:30 AM |
Welcome, ECE Department Status Ken Yang – Interim Director UCLA CHIPS, ECE Department Chair |
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9:30 - 9:40 AM |
Release of the UCLA CHIPS Collected Publications |
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9:40 - 11:15 AM |
MRHIEP Leadership Team Gity Samadi – Semi, Venky Sundaram – 3D System Scaling , Eric Forsythe – NIST, Mary Ann Maher – SoftMEMS, Bapi Vinnakota – OCP, Mark da Silva – Semi, Anshu Bahadur – dotIT |
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11:15 AM - 1:00 PM |
Lunch (Faculty Club) |
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1:00 - 2:00 PM |
“Panel Discussion: The Role of Roadmaps in Advanced Packaging” George Orji – NIST (Moderator), Shekhar Chandrashekhar – iNEMI, Rahul Manepalli – Intel, Venky Sundaram – 3D System Scaling, Saverio Fazzari – BAH, Daniel Berger – NIST |
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2:00 - 2:15 PM |
“Vision for Samueli School of Engineering” Alissa Park – Dean UCLA School of Engineering |
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2:15 - 2:30 PM |
“California NanoSystems Institute (CNSI) – Overview” Jeff Miller – CNSI Director |
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2:30 - 3:00 PM |
“Advanced Packaging Technologies for Heterogenous Device Integration” Rahul Manepalli – Intel |
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3:00 - 3:30 PM |
“Fine Pitch Assembly Using Thermal Compression Bonding” Bob Chylak – K&S |
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3:30 - 4:00 PM |
“Hybrid Bonding for Advanced Packaging” Arsalan Alam – AMD |
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4:00 - 4:30 PM |
“NorthPole: Neural Inference at the Frontier of Energy, Space, and Time” Dharmendra Modha – IBM |
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4:30 - 4:45 PM |
“Composable ASICs Based on Standardized Chiplet Bricks” Andreas Olofsson – Zero ASIC |
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4:45 – 6:00 PM |
Poster Session and Reception |
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6:00 – 7:00 PM |
Lab Tour (Optional) |