Vineeth Harish
Electrical and Computer Engineering
Primary Area: Hybrid Wiring Layers and Fine Pitch Bonding
2022 - Present
Email: vineeth@g.ucla.edu
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Randall Irwin
Electrical and Computer Engineering
Primary Research Interests: Physical and Wave Electronics
2019 - Present
Email: rirwin004@ucla.edu
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Tanmay Konnur
MS, Materials Science and Engineering
Primary Area: Flip-chip bonding for flexible electronics applications
2023 - Present
Email: tanmaykonnur@g.ucla.edu
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Guangqi Ouyang
Material Science and Engineering
Primary Area: Physical and Wave Electronics
2019 - Present
Email: guangqiouyang@g.ucla.edu
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Siyun Qiao
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2020 - Present
Email: qiaosy@g.ucla.edu
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Haoxiang Ren
Electrical and Computer Engineering
Primary Area: Power Delivery; Wafer-scale System; III-V Integration
2020 - Present
Email: haoxiang.ren@g.ucla.edu
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Golam Sabbir
Materials Science and Engineering
Primary Area: Metal Bonding and Thermal Science
2017 - Present
Email: gsabbir87@ucla.edu
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Krutikesh Sahoo
Electrical & Computer Engineering
Primary Area: Physical and Wave Electronics (PWE)
2019 - Present
Email: krutikesh@g.ucla.edu
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Mansi Sheth
MS, Materials Science and Engineering
Primary Area: Flexible Li-ion Batteries
2022 - Present
Email: shethmansi@g.ucla.edu
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Henry Sun
Electrical and Computer Engineering
Primary Area: Physical and Wave Electronics
2020 - Present
Email: Hsunhenry@ucla.edu
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Joseph Camyre
Computer Science
Primary Area: Software Systems
2021 - Present
Email: jcamyre127@g.ucla.edu
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Zoe Chen
Electrical and Computer Engineering
Primary Research Interests: Undecided
2022 - Present
Email: ayya0531@g.ucla.edu
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