Manufacturing Roadmap for Heterogenous Integration and Electronics Packaging
(MRHIEP)
Agenda for in- person publication of draft roadmap
Room # 154 Moscone Center South, San Francisco CA
2.00 pm PST to 4.30 pm PST, July 10th, 2023
|
Time |
Topic |
Speaker |
|
2.00 – 2.20 pm |
Introduction and Goals |
Subramanian Iyer |
|
2.20 – 3.00 pm |
Process and tooling |
Venky Sundaram, Eric Forsythe |
|
3.00 – 3.20 pm |
Cross cutting issues: modeling, thermal and reliability |
Benson Chan |
|
3.20 – 3.35 pm |
Mechanical and electrical standards |
Bapi Vinnakota |
|
3.35 – 4.00 pm |
Supply chain, security, test and smart manufacturing |
Mark da Silva |
|
4.00 – 4.30 pm |
Panel discussion on next steps, Refreshments |
Moderated by Gity Samadi
|
|
4.30 pm |
Adjourn |
|